Thermo-energy-management of solid-state devices

ABSTRACT

The present invention reduces to practice discoveries made by the present inventors during their investigations into present-art-perceived-difficulties in thermal-management applications of solid-state devices.

DOMESTIC PRIORITY DATA

This application claims benefit of 60/940,336 May 25,2007

INTRODUCTION

The present invention reduces to practice discoveries made by thepresent inventors during their investigations intopresent-art-perceived-difficulties in thermal-management applications ofsolid-state devices. The present invention overcomes said present artproblems via alternative composites of ferrite-torus (tori) element(s),thermoelectric(s) element(s), ion-pump-fan(s) element(s), sensor(s)element(s), communication(s) element(s), enclosed or confined within anenclosure resembling a commonly encountered Edison-type incandescentlight bulb volume. The present invention provides the utility of theencountered Edison-type incandescent light bulb, including shape,thermal-signature, illumination and use of existing electrical powersocket(s).

DISCUSSION OF PRESENT ART

The present invention is exemplified in the novel utilities achieved vianon-apparent arrangement of parts shown in the accompanying drawings anddescribed in the following specification and it is more particularlypointed out in the appended claims.

The provision of a thermal-management device and its means and methodsof achieving its novel utilities of the character referred to aboveconstitutes the principal object of this invention.

In reference to U.S. Pat. No. 2,758,261 issued August 1956, to Armstronget al. (Armstrong '261), Armstrong '261 teaches that (col. 1, line 26) “. . . certain plastics, upon setting, have a coefficient of expansion orcontraction which is different from the coefficient of expansion orcontraction of the semiconductive materials to which they are bonded.This results in stresses being set up within the semiconductors whichmay cause pushing or pulling of the terminal leads attached to, or incontact with, the junction material and result in the deformationthereof. A sufficient amount of deformation causes the effective barrierresistance between the junction material and the semiconductorundesirably to be reduced to extremely small values and may even resultin a short circuit therebetween.” The present invention directlyaddresses Armstrong '261's identified problems by providing the abilityto provide a near constant caloric-density environment of the differentmaterials and thereby eliminating the problems identified by Armstrong'261's reference to coefficient of expansion or contraction of differentmaterials and the resultant, due to temperature change, of “ . . .stresses being set up within the semiconductors.”

In reference to U.S. Pat. No. 4,211,955 issued July 1980, to Ray (Ray'955), Ray '955 teaches (col. 1, line 13) “Solid state light sources perse, such as light-emitting diodes, are well known in the prior art, butnone of these is suitable as a complete replacement for a standard A.C.or D.C. incandescent lamp.” (col. 1, line 19) “ . . . object of thisinvention is to provide a novel solid state lamp having a standardincandescent lamp base which can be used with existing incandescent lampsockets.” (col. 1, line 30) “Still another object of the invention is toprovide such a novel solid state lamp wherein the integrated circuitchip contains rectifier and voltage regulator circuits so the lamp canbe energized by standard house current of 120 volts or 220 volts A.C.”The present invention incorporates the above teachings of Ray '955.

In reference to U.S. Pat. No. 4,600,979 issued July 1986 to Fisher et al(Fisher '979), Fisher '979 teaches that (col. 1, line 12) “In diverseenvironments there are found devices, such as lights, in which a heatgenerating means is contained within a sealed enclosure. It will bereadily appreciated that due to the heat produced within such enclosureby the heat generating means, the temperature in the enclosure canquickly rise to levels sufficient to damage the components internal tothe enclosure.” (col. 2, line 49) “In operation, the heat generated bythe various lamps within the lamp housing is transmitted to the radialfins of the lamp housing. While the system provided herein functionsmost efficiently when in the vertical position, which will be describedherein, it is to be understood that the principles of the inventionobtain regardless of orientation. The heat is transferred by conductionfrom the hotter lower portions of the fins to the top portions of thefins. Due to the increasingly large area and, hence, presence of coolerair between the annular wall and the top of the enclosure cover, theheat from the tops of the fins is transmitted to the cooler air withinsuch area. This action causes heated air to move radiant outward fromthe tops of the fins along the top of the enclosure. During thisprocess, the heat contained by the heated air is transmitted to the topcover of the enclosure which allows such heat to be radiated from thelarge area of the enclosure cover to the cooler surrounding ambientoutside the light. As the heat is removed from the air which is presentbetween the annular wall and the top of the enclosure cover, it falls tothe area between the lower portion of the cylindrical sidewall and theannular wall. From this point the air is driven through the slots andthe is directed toward the heated fins due to the slightly higherpressure caused by the newly heated air being moved into contact withthe top of the enclosure cover and filling the outer chamber definedbetween the enclosure's cover and the outside of the inner annularwall.” The present invention incorporates the above teachings of Fisher'979.

In reference to U.S. Pat. No. 4,727,289 issued February 1988 to Uchida(Uchida '289), Uchida '289 teaches that (col. 1, line 12) “Conventionallight-emitting diode (LED) lamps use either a 12- or 14-V power sourceand cannot be connected directly to the general AC outlet power source(100 V). As shown in FIG. 6, a conventional LED lamp of this type has abase 2 attached to one end of a glass bulb 1. A printed circuit board 5is mounted within the glass bulb 1 through a stem 3 and stays 4. Aplurality of light-emitting diodes (LEDs) 6 are mounted on the printedcircuit board 5. A current is supplied to the LEDs 6 through a seriesresistor 7.” (col. 1, line 23) “Since the LED lamp having the abovearrangement uses either a 12- or 14-V power source, a low power seriesresistor 7 can be used and mounted within the glass bulb. However, whena 100-V power source is used, a large, high-power resistor is required,which is quite difficult to incorporate in the glass bulb. For example,when a series resistor is provided immediately under the printed circuitboard, heat generated by the resistor degrades the characteristics ofthe LEDs. In addition, since a 100-V LED circuit is formed within asingle glass bulb, the size, shape and number of the means for mountingthe series resistor are restricted.” (col. 1, line 38) “The presentinvention has been made in order to solve the problem that has arisen inthe course of an attempt to upgrade the conventional low-voltage LEDlamp to a 100-V LED lamp, wherein the characteristics of the LEDs aredegraded by heat generated by the series resistor, and to solve theproblem of the various restrictions in relation to mounting the seriesresistor.” (col. 1, line 44) “According to the present invention, as apractical means for solving the above problems, a lamp comprises aprinted circuit board which is arranged inside a glass bulb having abase at an end thereof; a stem in said glass bulb; and means formounting said printed circuit board to said stem. A plurality of LEDsare mounted on the printed circuit board. A current is supplied to theLEDs through a series resistor. The series resistor has an annular shapeand is fitted around the stem. Therefore, the LEDs mounted on theprinted circuit board are not affected by the heat generated by theseries resistor. In addition, since the series resistor has an annularshape, it has a high power handling capacity. Therefore, the resultantLED lamp can be used at a high voltage.” (col. 3, line 3) “As describedabove, according to the present invention, the series resistor connectedinside the LED lamp has an annular shape, so that it can have a largesize and a large power handling capacity. Thus, even if a 100-V ACoutlet power source is used, sufficient resistance and capacitance canbe obtained, so that the LED lamp of the present invention can be usedas various illumination lamps and as general ornamental sign lamps.” Thepresent invention incorporates the above teachings of Uchida '289.

In reference to U.S. Pat. No. 4,967,330 issued October 1990, to Bell etat. (Bell '330), Bell '330 teaches that the above (col. 1, line 54) “TwoU.S. patents issued for LED lamps are representative of those seeking toexploit these features: U.S. Pat. No. 4,211,955 issued to Stephen W. Rayand U.S. Pat. No. 4,727,289 issued to Akio Uchida. The Ray patentdescribes an area-illuminating solid state lamp having the appearance ofa standard incandescent light bulb with LEDs enclosed within a globe ofsolid translucent plastic. It also illustrates the two featuresnecessary for the utilization of LEDs in this application—a currentadjustment element (in this case featuring a rectifier as well as aresistor) and a generally cylindrical base capable of interfacing withstandard incandescent light sockets. However, it is seriously restrictedin use because of the closed nature of its encasement. The performanceof LEDs degrades as temperature (generated by current reducing/controlelements) becomes elevated. The closed nature of the Ray device causesthe accumulation of waste heat generated by the device. A solution tothis problem is attempted by Uchida, who utilizes an annular-shapedresistor fitted around the stem of the lamp as a means of overcomingthis problem; however, the solution utilized herein is far simpler, andleads to a device that overcomes the temperature build-up problems ofprior patents, is far simpler and less expensive to manufacture, and hasnumerous additional advantages as set forth below.” (col. 2, line 40)“The objects of this novel design are numerous. First, the open natureof the encasement, particularly of the section of said encasementbetween the electric contact at its base and the LED(s) enclosed, allowsheat generated by the current adjustment element to readily escape.Second, its construction is much simpler than the prior LED lampsdescribed as there is no sealed or closed container to be constructedand its component parts are easily manufactured using simple techniquesfrom readily available materials and parts. Third, it is readily adaptedfor use and insertion into a wide variety of sockets and, wheredesirable, for insertion into a socket from the socket's rear, ratherthan forward side.” The present invention incorporates the aboveteachings of Bell '330.

In reference to U.S. Pat. No. 4,729,076 issued March 1988 to Masami etal. (Masami '076), Masami '076 teaches of an (col. 3, line 12) “ . . .enclosure 12 . . . a compartment or housing for the light source 14, thedriver circuit 16 and other components. . . . ” (col. 3, line 38)“According to the invention, the light source 14 comprises an array ofsemiconductor light emitting diodes (“LED”) 22 which can include laserdiodes.” (col. 4, line 11) “To augment the operation of heat sink 26,the portable photocuring device 10 can include a fan 27. The fan 27 issized to fit inside the housing 12 and run from the power feed 20. Theenclosure 12 includes one or more exhaust ports 28 for the exhaust sirfrom the fan 27. In addition, the enclosure 12 includes an input port 30to allow the circulation of fresh air. The input port 30 can also becoupled to a compressed air flow 32 which is supplied by the dentalconsole. It will be appreciated that the compressed air flow 32 caneliminate the need for the fan 27.” The present invention incorporatesthe above teachings of Masami '076.

In reference to U.S. Pat. No. 5,404,282 issued April 995 to Klinke etal. (Klinke '282), Klinke '282 teaches that (col. 2, line 61) “LEDmodules known in the art have attempted to minimize the potential forthermal damage to the LED lamps by constructing the LED leads frommaterials having a low thermal conductivity, such as steel. Usingmaterials of low thermal conductivity reduces the amount of heat thatcan be transferred from the solder site to the LED chip itself. However,materials having low thermal conductivity necessarily have acorrespondingly low electrical conductivity. Therefore, the methods usedin the art to minimize the thermal damage of the LED lamps during thesoldering operation has resulted in the construction of a LED modulethat does not display optimal electrical efficiency. Additionally, LEDleads constructed from such low thermal conductivity materialseffectively limit the amount of power that the LED can dissipate andremain within reliable operational parameters.” The present inventionincorporates the above teachings of Klinke '282.

In reference to U.S. Pat. No. 5,782,555 issued July 1998 to Hochstein(Hochstein '555), Hochstein '555 teaches that (col. 2, line 6)“Obviously, venting the L.E.D. . . . lamp assembly or module into thesealed . . . housing is futile. Rejecting heat into an environment ofhigher temperature than that of the source is thermodynamicallyimpossible. The key to improving the life of the L.E.D.'s . . . is toreduce the temperature of the L.E.D. environment. Note that little canbe done to modify the “ambient” temperature which is the normalsurrounding sir temperature.” (col. 2, line 14) “U.S. Pat. No. 4,729,076to Masami et al strives to lower the temperature of the LED array byattaching a finned heat sink assembly. However, there is a choke orrestrictor in the path of the heat from the light emitting diodes to theheat sink: to wit, a resin filler or adhesive which is a very poor heatconductor. The Masami '076 patent recognizes the problem of positioningthe heat sink within the traffic signal housing where it must exchangeheat with the air within the housing. As noted in the Masami '076patent, some means of ventilation must be provided by vents, louvers,fans or the like, when the heat sink is within the housing. Suchprovisions are not particularly effective in hot climates, and theysubject the signal to dirt and moisture infiltration.” (col. 3, line 17)“ . . . the invention provides two solutions to the heat dissipationproblem which can be utilized in combination or separately to open therestriction or choke of heat flow from the LEDs to the heat sink and/orto extend the heat sink from close proximity to the LEDs to the ambientair forwardly of the lamp assembly, either of which significantlyreduces the build up of temperature within the housing and when combinedprovide heretofore unattainable low operating temperatures within thehousing.” The present invention teaches away from Hochstein '555's“passive” cooling regime via “active” cooling or heating with itsincorporation of TEs, ion-pump-fan element(s) and other elements.

In reference to U.S. Pat. No. 5,785,418 issued July 1998 to Hochstein(Hochstein '418), Hochstein '418 teaches that (col. 3, line 64) “Tryingto dissipate heat from an LED . . . module into such a high temperatureenvironment is impossible and, in fact, heat flows in the oppositedirection; that is from the elevated ambient surrounding the device intothe LED . . . housing. Given the high thermal conductivity housingsdisclosed in the prior art, the deleterious heat transfer from anelevated ambient into the LED array is actually maximized, therebyoverheating the LEDs: dimming them and shortening the life of thedevices.” The present invention incorporates Hochstein '418'sobservations on “ . . . the deleterious heat transfer . . . therebyoverheating the LEDs: dimming them and shortening the life of thedevices.” The present invention teaches away from Hochstein '418'steaches that of (col. 4, line 23) “ . . . provid(ing) a directionallyselective heat sink and dissipater which enhances dissipation of heatfrom an LED array to the surrounding air, but retards heat flow into theLED array from high temperature sources such as solar heated air or fromdirect solar radiation.”

In reference to U.S. Pat. No. 5,857,767 issued January 1999 to Hochstein(Hochstein '767), Hochstein '767 teaches that (col. 1, line 23) “Oneaspect of LED technology that is not satisfactorily resolved is theapplication of LEDs in high temperature environments. LED lamps exhibita substantial light output sensitivity to temperature, and in fact arepermanently degraded by excessive temperature.” (col. 1, line 45)“Permanent thermal degradation of LEDs also occurs during arrayfabrication, when the LEDs are soldered to the supporting and/orinterconnecting circuit board. Typical soldering temperatures (250° C.)can significantly degrade the LED array before it is even put intoservice. LED manufacturers recommend the use of lead lengths ofsufficient length to prevent excessive heat transmission from thesoldering operation into the LED die. Of course, the added lead lengthacts detrimentally during LED operation, as the longer leads increasethe thermal resistance and adversely affects the rejection of selfgenerated heat.” The present invention incorporates the above teachingsof Hochstein '767.

In reference to U.S. Pat. No. 6,045,240 issued April 2000 to Hochstein(Hochstein '240), Hochstein '240 teaches that (col. 3, line 4) “severalprior art patents address the question of heat extraction from an LEDarray, but an essential parameter in the successful implementation ofthis art has eluded previous investigators. Many technical issues mustbe carefully considered in the design of reliable LED signals, but amongthe most important are the thermal properties of the various componentsthat form the heat flow path.” (col. 3, line 31) “The interaction of thethermal properties of . . . materials, in LED arrays, indicates thatprior approaches to the problem were not well conceived nor wellunderstood. In fact, studies of existing hardware that embody thetechnology described by the prior art, show that at least an order ofmagnitude improvement in performance is attainable by the application ofthe methods and apparatus of the present invention.” (col. 3, line 41)“Typically, the prior art, as exemplified by Roney, et al. in U.S. Pat.Nos. 5,528,474 and 5,632,551, comprise an LED circuit board potted orencapsulated in a filled resin matrix within a metal shell. The intendedpurpose of the filled resinous encapsultat, which may be a thermallyconductive epoxy, is to conduct heat from the LED array into the metalhousing which acts as a heat dissipater.” (col. 3, line 47) “Theimprovement in thermal performance of LED devices that embody thetechnology taught by Roney, et al. over the apparatus disclosed byMasami, et al. in U.S. Pat. No. 4,729,076 is substantial.” (col. 3, line52) “Masami's use of unfilled resin and a non thermally coupledinsulation sheet greatly diminishes the flow of heat from the LED arrayto the heat dissipater.” The present invention incorporates the aboveteachings of Hochstein '240.

In reference to U.S. Pat. No. 6,220,722 issued April 2001 to Begemann(Begemann '722), Begemann '722 teaches that (col. 1, line 49) “It hasbeen found that LEDs having a luminous flux of 5 lm or more can only beefficiently used if the lamp comprises heat-dissipating means. Customaryincandescent lamps can only be replaced by LED lamps which are providedwith LEDs having such a high luminous flux. A particular aspect of theinvention resides in that the heat-dissipating means remove the heat,generated during operation of the lamp, from the substrate via the gearcolumn to the lamp cap and the mains supply connected thereto.” (col. 2,line 32) “Yet another embodiment of the LED lamp is characterized inthat means are incorporated in the column, which are used to generate anair flow in the lamp. Such means, preferably in the form of a fan, canbe used, during operation of the lamp, to generate forced air cooling.In combination with the heat-dissipating means, this measure enablesgood heat dissipation from the gear column and the substrate.” Thepresent invention incorporates the above teachings of Begemann '722

In reference to U.S. Pat. No. 6,274,924 issued August 2001 to Carey etal (Carey '024), Carey '024 teaches that (col. 1, line 9) “Most lightemitting devices (LEDs) emit incoherent light. One performance measureof an LED is photometric efficiency, e.g. the conversion of input energyinto visible light. Photometric efficiency is inversely proportional tothe junction temperature of the LED. A major concern of the LED packagedesigner is keeping the die cool to provide good overall performance.”(col. 1, line 20) “The prior art packages. . . . Because the die, theoptical cavity, and the encapsulant have different thermal coefficients,they expand and contract at different rates during operation. Thisplaces a high mechanical stress on the LED. In addition, the prior artpackages lack thermal isolation between the electrical and the thermalpaths because the electrical leads are the primary thermal paths. As aresult, the packaged die are subject to thermal stresses from thetemperature cycling. . . . ” (col. 1, line 35) “These problems areexacerbated as the die increases in area or input power. Because adevice having a larger junction area, . . . requires a larger opticalelement . . . to provide comparable light extraction efficiency, a largeoptical cavity is necessary. The mechanical stress applied to the LEDincreases with the volume of the encapsulant. In addition, the stressincreases as the packaged LED is exposed to temperature cycling and highmoisture conditions. The accumulated mechanical stresses reduce theoverall LED reliability.” (col. 1, line 46) “Since prior art packagesuse their electrical leads as primary thermal paths, the high thermalresistance of these paths combined with the high thermal resistance ofthe external system creates high junction temperatures, when powerdissipation increases. . . . High junction temperature contributes toaccelerating the irreversible loss of photometric efficiency in the LEDchip and also accelerates processes that contribute to the failure ofmechanical integrity of the LED package.” The present inventionincorporates the above teachings of Carey '024, it being noted assignificant Carey '024's illumination that the LED “ . . . electricalleads are the primary thermal paths . . . . ” The present inventionincorporates Carey '024's observation on electrical leads being theprimary thermal paths into the present invention's TM and as vis-a-viaother electronic elements as well.

In reference to U.S. Pat. No. 6,517,218 issued February 2003 toHochstein (Hochstein '218), Hochstein '218 teaches that (col. 1, line13) “Assemblies in the prior art include a light emitting diode (LED)with first and second electrical leads for conducting electricity to andfrom said light emitting diode, and a heat sink.” The present inventionincorporates Hochstein '218's teachings of utilizing a heat-sink as partof the electrical circuitry for energizing an assembly's LED(s).

In reference to U.S. Pat. No. 6,561,680 issued May 2003 to Shih (Shih'680), Shih '680 teaches that (col. 1, line 15) “recent developments inmaking high temperature and high brightness LEDs have expanded the useof LEDs. . . . Even with new high-temperature LED technology, however,LEDs still exhibit a substantial decrease in light output when thetemperature of the LED junction increases. For example, an increase of75° C. at the junction temperature may cause the level of luminous fluxto be reduced to one-half of its room temperature value. This phenomenonlimits the amount of output from conventional LEDs.” The presentinvention teaches away from Shih '680 by providing “active” TM whichallows for the capture and utilization of Shih '680's referenced “ . . .one-half . . . ” reduction in light-output due to high operatingtemperature.

In reference to U.S. Pat. No. 6,634,771 issued October 2003 to Cao (Cao'771), Cao '771 teaches of (col. 10, line 7) “a thermoelectric coolerlocated on said heat sink, said thermoelectric cooler experiencing adecrease in temperature when exposed to a voltage, an air entrance, anair exit, and an interior airflow path through said secondary heat sink,said airflow path permitting air to enter said heat sink through saidair entrance, absorb heat from said secondary heat sink and exit saidheat sink through said air exit, air located within said enclosure, afan within said enclosure for bringing air into said air entrance andforcing air through said airflow path and through said air exit.” Thepresent invention improves on Cao '771 with the novel application of thepresent invention's “active” sensor feedback, ion-pump-fan,ferrite-torus, the other elements and said elements multiple roles inthe present invention's TM.

In reference to U.S. Pat. No. 7,140,753 issued November 2006 to Wang etal. (Wang '753), Wang '753 teaches that (col. 1, line 29) “Aconventional method for dissipating heat from modulized LEDs is toenlarge a heat dissipating plate. This increases the direct contact areabetween the modulized LEDs and the heat dissipation plate. Further, afan providing an air-cooling function can be added. In addition toincurring further costs, significant heat still remains thereby reducingluminance. Hence, an improvement over the prior art is required toovercome these disadvantages.” The present invention directly addressesWang '753's identified problems with the present art.

In reference to U.S. Pat. No. 7,178,941 issued February 2007 to Robergeet al (Roberge '941), Roberge '941 teaches that (col. 67, line 65) “8. Amethod of claim 1, further comprising providing a fan for circulatingair within the housing to dissipate heat from the light sources and thepower facility.” (col. 68, line 1) “9. A method of claim 8, furthercomprising providing a thermal sensor wherein the fan operates inresponse to a temperature condition sensed by the thermal sensor.” Thepresent invention teaches away from Roberge '941 by ignoring the“thermal” condition of the overall device and, rather, measuringlight-output as the controller of the present invention's TM.

In reference to U.S. Pat. No. 7,188,984 issued March 2007 to Sayers etal (Sayers '984), Sayers '984 teaches that (col. 1, line 35)“Incandescent lights . . . ” (col. 1, line 45) “Most of the electricalenergy they consume is wasted in the form of heat while less than 7% ofthe energy they consume is typically radiated as visible light.” (col.1, line 64) “Moreover, the illuminance of an incandescent light sourcedepreciates over time. It is very common for a filament type lightsource . . . to loose more than 25% of its output when compared to theinitial output of the bulb.” (col. 2, line 1) “Very long life halogenbulbs may loose up to 50% of their output over their useful life.” Thepresent invention directly addresses the problem of present artincandescent and halogen light sources as both experience significantdegradation in serviceable light output over their service life. Thruits “active” TM regime, the present invention provides the ability tomaintain an initial illumination level throughout the presentinvention's service life, this facet being a direct improvement over thepresent art incandescent (Sayers '984), the halogen and the present artLED illumination products commercially available.

In reference to U.S. Pat. No. 7,210,832 issued May 2007 to Huang (Huang'832), Huang '832 teaches that (col. 1, line 41) “As a high-power orhigh-brightness illumination apparatus of light emitting diodesconcerned, such as above 30-100 W (watt), it is hard to design aneffective heat dissipation means for the LED illumination apparatuswithout fans. A traditional method of solving the heat dissipationproblem is adapting a plurality of cooling fins attached on a base ofthe illumination apparatus and the heat generated from the lightemitting diodes is conducted to the cooling fins via the base, thenusing an electric fan to blow the heat away, and thereby the heat isdissipated away. As the above-mentioned descriptions the traditionalmethod of heat dissipation usually requires a large space for setting upthe plurality of cooling fins near the illumination apparatus andfurther needs to install an electric fan, that causes noise andreliability problems when it was used outdoors.” The present inventionrecognizes Huang '832 problem statement with the use of fans in thepresent art which “ . . . causes noise and reliability problems . . . ”and overcomes the present art's use of fans by the novel application ofion-pump-fan configuration(s) which do not cause noise and having nomoving parts, directly addresses the inherent reliability problems astaught by Huang '832 with present art fans in applications ofthermal-management of LED devices.

DESCRIPTION OF THE INVENTION

The present invention reduces to practice discoveries made by thepresent inventors during their investigations intopresent-art-perceived-difficulties in thermal-management applications ofsolid-state devices.

The present invention provides means and methods of integratinglight-emitting-diodes (LED), other solid-state elements, or othersolid-state end-use elements providing sensing, broadcasting orinteracting with other electrical elements, into athermal-energy-management configurations utilizing commonly encounteredpresent art electrical socket(s) and electrical service(s) such asstandard metal incandescent light bulb sockets and electrical service(s)such as 110 v. or 220 v. AC.

Specifically, the present invention incorporates ferrite-based torus(tori), thermoelectric(s), ion-pump-fan(s) and in some embodiments,sensing of desired output(s) of solid-state devices and/or wirelesscommunication to said solid-state devices, with support solid-stateelements, in novel ways, to achieve commercially viablethermal-management (TM) of said solid-state devices for the purposes ofenhancing the performance and utility of said solid-state devices.

For the purpose of this discussion the term light-emitting-diodes (LED)may be assumed to be interchangeable with other thermally-sensitivesolid-state devices such as but not limited to microprocessors,electro-illuminators, liquid-crystal-displays (LCD), nano-devices andsimilar devices.

An example of an embodiment of the present invention configuresferrite-based torus (tori), thermoelectric(s) and ion-pump-fan(s) withLEDs for use in usually encountered present art incandescent electriclight bulb socketry with AC electrical service and dispensing with anyadditional modifications required of said existing incandescent electriclight infrastructure. That is, the present invention incorporates thepresent inventors' discoveries, in novel ways, into a device similar inoutward appearance to the typical present art incandescent light bulb orEdison-type light bulb (E-bulb) thereby providing solid-state advantagesof lower energy consumption for a given unit of light output, longerservice-life-expectancy; greater reliability, in a manner not apparentto the public or taught by the present art.

The non-apparent nature of the present invention, when applied as anincandescent electric light bulb substitute thru the use ofthermally-sensitive LED(s), where both its outward appearance and usageare closely similar to that of the standard incandescent electric lightbulb provides important economic viability characteristics. For example,the present invention, via its thermal-management (TM) means andmethods, provides a heat signature similar to present art incandescentlight bulbs.

Another example of the present thermal-management (TM) inventionproviding an appearance similar to the present art incandescent lightbulb is its use of a structural element supporting the presentinvention's ion-pump-fan which is generally located in the center of thebulb and providing an appearance similar to the typically encounteredillumination filament or stem found in present art incandescent lightbulb.

A central aspect of the present invention, relating to the aboveexample(s), is the use of one (1) or more torus (tori) in multiple rolesof: a) transformer of AC to DC (or DC to AC) current, b) thermal-massheat-sink, c) structural support for attachment of solid-state elementsand said solid-state elements' physical structural support(s), d)physical protection from impact shock for said solid-state elements andelectronic/electrical wiring from/to said solid-state elements, e) acentral element of intended thermal energy flow-path structure, f)structural attachment to standard, present art, electrical light bulbsocket, i.e. screw-in-bulb-metal-base, g) torus' hollow center providinga protected, armored, conduit for electric power service to saidlight-source and/or available use for locating heat-pipe type feature(s)or function(s) which are not inclusive of the present invention, and h)a conduit for fluid moved by the action of the present invention'sion-pump-fan(s). This invention's multi-use of a ferrite-based torusadvances the present art in novel, non-apparent, ways.

Another central aspect of the present invention, relating to the aboveexample(s), is the use of one (1) or more ion-pump-fan(s) in multipleroles of: 1) imparting movement on a fluid originating external from thepresent invention, said fluid passing by said electronic elements, thruand/or around said torus hollow and exiting out of said presentinvention, 2) providing an appearance similar to an incandescent bulbfilament or stem, and 3) enhancing the thermal signature of the bulbenclosure in mimicking that of an incandescent light bulb. Inclusion ofmulti-pin or multiple ion-pump-fan(s) needles is anticipated by thepresent invention.

Yet another central aspect of the present invention is the multipleroles played by the present invention's faux-illumination-filament orstem, wherein the stem provides: i) said mimic filament, ii) a physicalstructural support for referenced ion-pump-fan(s), iii) influence onfluid-flow caused by either referenced ion-pump-fan's movement of saidfluid or convection or both, and iv) structural support for one or morelight-sensors, in the present invention's embodiment's use of alight-sensor, to control the thermal-management-affects on light output,(or in the TM of a microprocessor, the flip count), v) where said sensoror sensors are employed, the stem provides structural support forantenna(s) for use of wireless communication with said sensor or sensorsto modify the sensitivity and/or setting of elements which can modifythe present invention's thermal-management, and vi) in otherembodiment(s) providing structural integrity to the present invention'sphysical manifestation by providing a physical and/or thermal load pathfrom electrical socket to the crown of the bulb structure when said stemis structurally attached to said bulb structure crown.

Still another central aspect of the present invention is the multipleroles performed by the present invention's screw-base. In addition tothe use of such screw-base allowing utilization of existing incandescentbulb sockets and electrical power supply and providing structuralsupport, some of the present invention's embodiments utilize portions ofsaid screw-base for the construction and electrifying the capacitor(s)for driving the present invention's ion-pump-fan(s).

Another central aspect of the present invention, relating to the aboveexample(s), is the use of a standard incandescent electric light's glassbulb shape in multiple roles of: α) lightweight,transparent/translucent, physically protecting the overall device'ssolid-state elements, β) non-electrically-conductive enclosure, γ) high,selective, thermal conductivity characteristics providing for thermaltransport directly away from thermal source(s) of solid-state elementgenerated waste heat, δ) heat-spreader, ε) unrestricted air-mass flowpast heat-spreader features, ξ) selected rough-surface-areas (nearand/or on “top” or “crown” portion of bulb structure) of enhancedsurface-areas to projected surface area for enhanced transfer oftransferred waste-heat to passing air-mass. Said multi-facettedsubstitute of an incandescent electric light's glass bulb is preferablymade of transparent/translucent polycarbonate (PC) and/orpolymethylmethacrylate (PMMA) and/or reinforced polymer composite(s)(FRCs) including but not limited to compositions of thermally conductivecarbon fibers and/or nano-fibers.

OBJECT OF THE INVENTION

The objects of this novel design are numerous.

The invention is exemplified in the combination and arrangement of partsshown in the accompanying drawings and described in the followingspecification and it is more particularly pointed out in the appendedclaims. Any one of these characteristics alone will aid in enhancing theperformance of thermally sensitive solid-state devices and will makepossible better control of said thermally sensitive solid-state devicesperformance, and a complete solution of the difficulties associated withthermally sensitive solid-state devices is readily possible by employingan two or more of these characteristics in combination.

The invention has for its object the provision of thermal-management(TM) which is more convenient and flexible in its application than TMschemes heretofore devised, which is economical to integrate withexisting thermally sensitive solid-state devices, to manufacture,convenient to install, and which will permit higher desired-output toenergy-input ratio(s) for said thermally sensitive solid-state devicessuch as LED light-output than was heretofore possible.

A further object of the invention is to provide a method for reducingthe intensity of mechanical stresses exerted on semiconductive devicesby the material in which they are encased by providing a thermallystable micro-environment.

Still another object of the invention is to provide such novel TM thatcan be energized by standard electrical current of 120 volts or 220volts A.C.″

Another object of the present invention is to provide a TM/LED lamp thatgenerates the desired spectrum in a bright and substantially uniformpattern so that the light therefrom may be observed from a distance overa wide range of viewing angles.

Still another object of the present invention is to provide an improvedTM/LED lamp construction that readily and more efficiently replacesexisting incandescent bulbs heretofore in use.

A still further object of the present invention is to provide animproved TM/LED lamp construction that can be economically manufacturedand made adaptable for use in a wide variety of household, commercialand industrial lighting applications.

It is a general object of this invention to provide a TM/LED lightingsystem which is automatic in operation. The provision of a TM/LEDlighting device of the character referred to above constitutes aprincipal object of this invention.

This invention relates generally to semiconductor devices and moreparticularly to protecting the junctions of such thermally sensitivedevices.

The main stimulant behind development of the present invention'sthermal-management (TM) means and methods has been its use to radicallyimprove the efficiency of incandescent lamp alternatives based onlight-emitting-diodes. Up to the present time this scheme has not beencommercially successful because the known present art TM has notaddressed the numerous inherent limitations of thermoelectric devices,moving-part-fans, and failure to directly address the intended, desired,output and the controlling aspect of the TM chosen. Numerous effortshave been made to provide an LED lighting fixture whereby the waste-heatgenerated in the fixture would be prevented from causing deterioration.While certain of the present art schemes offer solutions to the heattransfer problems, none has provided a satisfactory degree ofthermal-management.

PREFERRED EMBODIMENT

The present invention's preferred embodiment is as areplacement/substitution for a commonly encountered incandescent lightbulb, as described herein and best described and presented as shown inthe accompanying FIGS. 26, 32, 34, 35, 36 & 37, and as described in thedescription of said FIGURES below. Specifically, the preferredembodiment incorporates a common semiconductive layer or plate with thethermally-sensitive solid-state device to be thermally-managed and afirst thermoelectric/heat-sink and a second common semiconductive layeror plate with a second thermoelectric/heat-sink and supportelectric/electronic devices, with said above first couple and said abovesecond couple sandwiching a ferrite-torus AC-to-DC element. Saidsandwich is generally within the confines of a double-shell outwardlyapparent standard Edison-type incandescent light bulbscrew-to-socket-configuration, with said volume defined by saiddouble-shell utilized for fluid-flow channeling and for high-voltagecapacitor(s) used to drive above referenced ion-pump-fan(s). Saidfluid-flow, actuated via said ion-pump-fan(s) and thermal-gradient,moving thru and between that referenced above, and pictured in thedrawings and descriptions of said drawings, elements of the compositethermal-management structure. Said thermal-management effectuated viasensor(s) and manipulated via wireless communications.

DESCRIPTION OF DRAWINGS

The reader should note, lower case italic letters, on drawings,reference identical elements of the design from drawing to drawing,while superscript Arabic numbers on said lower case italic lettersreference FIGURE Nos., and stand alone Arabic numbers are references tocross-sectional aspects from drawing to drawing. The sequence ofFIGURES, beginning with FIG. 1, which shows, as an example, an initialplatform of a solid-state light source or light sources structurallyattached, or an integral part of, one or more semi-electrical surfaces,is intended to show a build-up of discrete elements and/or functions forthe present invention's thermal-management (TM). While the said sequenceis a presented method, of the present invention, it is intended thatsuch sequence is but one of many possible sequences to achieve thepresentation of the objects of the present invention to the reader.

FIG. 1, is a top view, wherein α¹ designates one or more solid-statelight source(s), and b¹ designates one or more semi-electricallyconductive surface(s) of one or more semi-conductive material(s)composition(s) configuration(s) sheet(s) or plate(s) and utility(ies).

FIG. 2, is a cross-sectional view taken along line 1-1 of FIG. 1,wherein α² designates one or more solid-state light source(s), b²designates one or more semi-electrically conductive surface(s) of one ormore semi-conductive material(s), composition(s), configuration(s),sheet(s) or plate(s) and utility(ies).

FIG. 3, is an alternative configuration utilizing one or morerectangular (or square) semi-electrically conductive surface(s) of oneor more semi-conductive material(s), composition(s), configuration(s),and utility(ies), wherein α³ designates one or more solid-state lightsource(s), and b³ designates one or more semi-electrically conductivesurface(s) of semi-conductive material(s), composition(s),configuration(s), sheet(s) or plate(s) and utility(ies).

FIG. 4, is a cross-sectional view taken along line 2-2 of FIG. 3,wherein α⁴ designates one or more solid-state light source(s), b⁴designates one or more semi-electrically conductive surface(s) ofsemi-conductive material(s), composition(s), configuration(s), sheet(s)or plate(s) and utility(ies). FIGS. 3 & 4 provide configuration for gapsbetween the semi-conductive sheet(s) or plate(s) and the standard“circular” screw-in socket of the commonly encountered light bulb. Suchgaps between the “square” semi-conductive sheet(s) or plate(s) and thesocket casing provides means for easy applications of, such as but notlimited to, additional electrical wiring, additional micro-sensors,additional thermal-flow and/or fluid-flow pathways, and/or attachmentsof structural elements.

FIG. 5 is as FIG. 1, which is a top view, wherein α⁵ designates one ormore solid-state light source(s), and b⁵ designates a semi-electricallyconductive surface of one or more semi-conductive material(s),composition(s), configuration(s), sheet(s) or plate(s) and utility(ies).FIG. 5 is provided so as to better show cross-section 3-3, whichprovides reference for FIG. 6.

FIG. 6, is a cross-sectional view taken along line 3-3 of FIG. 5,wherein α⁶ designates one or more solid-state light source(s), b⁶designates a semi-electrically conductive surface(s) of semi-conductivematerial(s), composition(s), configuration(s), and utility(ies), and c⁶designates one or more thermoelectric devices,

FIG. 7 is as FIG. 1, which is a top view, wherein α⁷ designates one ormore solid-state light source(s), and b⁷ designates a semi-electricallyconductive surface of one or more semi-conductive material(s),composition(s), configuration(s), sheet(s) or plate(s) and utility(ies).FIG. 7 is provided so as to better show cross-section 4-4, whichprovides reference for FIG. 8.

FIG. 8, is a cross-sectional view taken along line 4-4 of FIG. 7,wherein α⁸ designates one or more solid-state light source(s), b⁸designates a semi-electrically conductive surface(s) of semi-conductivematerial(s), composition(s), configuration(s), and utility(ies), c⁸designates one or more thermoelectric devices. FIG. 8 shows α⁸solid-state light source(s) sharing a common structure ofsemi-conductive material(s), sheet(s), and/or plate(s), said commonstructure, noted as α⁸, providing both the utility(ies) of b⁸ forsolid-state light source(s) α⁸ and the utility(ies) of electricallynon-conductivity of such structures incorporated into thermoelectricdevices.

FIG. 9 is as FIG. 1, which is a top view, wherein α⁹ designates one ormore solid-state light source(s), and b⁹ designates a semi-electricallyconductive surface of one or more semi-conductive material(s)composition(s), configuration(s), sheet(s) or plate(s) and utility(ies).FIG. 9 is provided so as to better show cross-section 5-5, whichprovides reference for FIG. 10.

FIG. 10, is a cross-sectional view taken along line 5-5 of FIG. 9,wherein α¹⁰ designates one or more solid-state light source(s), b¹⁰designates a semi-electrically conductive surface(s) of semi-conductivematerial(s), composition(s), configuration(s) and utility(ies), c¹⁰designates one or more thermoelectric devices. FIG. 10 shows α¹⁰solid-state light source(s) sharing a common structure ofsemi-conductive material(s), sheet(s) and/or plate(s), said commonstructure, noted as d¹⁰, providing both the utility(ies) of b¹⁰ forsolid-state light source(s) α¹⁰ and the utility(ies) of electricallynon-conductivity of such structures incorporated into thermoelectricdevices. In thermo-contact with thermoelectric device c¹⁰, shown incross-section, is/are electrically energized ferrite-torus or tori,designated as e¹⁰, said torus/tori is/are provided with non-electricallyconductive enclosure ƒ¹⁰.

FIG. 11, is a side view, showing said ell torus/tori as though thenon-electrically conductive enclosure ƒ¹¹ were transparent.

FIG. 12 is as FIG. 1, which is a top view, wherein α¹² designates one ormore solid-state light source(s), and b¹² designates a semi-electricallyconductive surface of one or more semi-conductive material(s),composition(s), configuration(s), sheet(s) or plate(s) and utility(ies).FIG. 12 is provided so as to better show cross-section 6-6, whichprovides reference for FIG. 13.

FIG. 13, is a cross-sectional view taken along line 6-6 of FIG. 12,wherein α¹³ designates one or more solid-state light source(s), b¹³designates a semi-electrically conductive surface(s) of semi-conductivematerial(s), composition(s), configuration(s) and utility(ies), c¹³designates one or more thermoelectric devices.

FIG. 13 shows α₁₃ solid-state light source(s) sharing a common structureof semi-conductive material(s), sheet(s) and/or plate(s), said commonstructure, noted as d¹³, providing both the utility(ies) of b¹³ forsolid-state light source(s) α¹³ and the utility(ies) of electricallynon-conductivity of such structures incorporated into thermoelectricdevices. In thermo-contact with thermoelectric device(s) c¹³, shown incross-section, is/are electrically energized torus or tori, designatedas e¹³, said torus/tori provided with non-electrically conductiveenclosure ƒ¹³. Said torus/tori, e¹³, is sandwiched between firstmentioned thermoelectric device(s) c¹³, and one (1) or morethermoelectric devices designated here as g¹³.

FIG. 14, is a side view of FIG. 13.

FIG. 15 is as FIG. 1, which is a top view, wherein α¹⁵ designates one ormore solid-state light source(s), and b¹⁵ designates a semi-electricallyconductive surface of one or more semi-conductive material(s),composition(s), configuration(s), sheet(s) or plate(s) and utility(ies).FIG. 15 is provided so as to better show cross-section 7-7, whichprovides reference for FIG. 16.

FIG. 16, is a cross-sectional view taken along line 7-7 of FIG. 15,wherein α¹⁶ designates one or more solid-state light source(s), b¹⁶designates a semi-electrically conductive surface(s) of semi-conductivematerial(s), composition(s), configuration(s) and utility(ies), c¹⁶designates one (1) or more thermoelectric devices. FIG. 16 shows α¹⁶solid-state light source(s) sharing a common structure ofsemi-conductive material(s) sheet(s) and/or plate(s), said commonstructure, noted as d¹⁶, providing both the utility(ies) of b¹⁶ forsolid-state light source(s) α¹⁶ and the utility(ies) of electricallynon-conductivity of such structures incorporated into thermoelectricdevices. In thermo-contact with thermoelectric device(s) c¹⁶, shown incross-section, is/are electrically energized torus or tori, designatedas e¹⁶, said torus/tori provided with non-electrically conductiveenclosure ƒ¹⁶. Said torus/tori, ^(e16), is sandwiched between firstmentioned thermoelectric device(s) c¹⁶, and one (1) or morethermoelectric devices designated here as g¹⁶. FIG. 16 shows inclusionof one (1) or more electric devices on the opposite side of the one (1)or more thermoelectric devices, identified as g¹⁶, from the torus/torie¹⁶. Said electric/electronic devices may include items such astransistor(s), shown here, as examples as two (2) transistors, h¹⁶, andcapacitor(s), shown here as three (3) capacitors, i¹⁶. Included in thisfigure is also an electrical contact, j¹⁶, intended to be compatiblewith commonly encountered electrical power supply sockets or attachmentssuch as 110 volt or 220 volt AC. Not shown but available is the sharingof a common structure of semi-conductive material(s) sheet(s) and/orplate(s), with thermoelectric devices, identified as g¹⁶ and solid-statedevices utilizing similar such semi-conductive material(s) as in themanner presented in FIG. 13.

FIG. 17, is a side view.

FIG. 18 shows a present invention's construction, utilizing that of FIG.16 as an example, situated within the confines of a commonly encounteredincandescent electric light bulb socket, shown, in cross-section, ask¹⁸. Also shown, as l¹⁸, are thermally non-conductive and/or thermallyand electrically non-conductive structure isolating either or boththermoelectric elements designated herein as c¹⁸ and/or g¹⁸. Thermalpathways are provided from the outer surface of the torus/tori, e¹⁸, viaa surrounding high thermally conductive medium, m¹⁸, a medium which canbe transparent and/or translucent and/or opaque, of plastic and/or metaland/or other high thermally conductive material, which geometricallytransforms and/or narrows into stalk-like substructures rising past thesolid-state light source, upward in reference to the FIG. 18, saidstalk-like substructures, designated herein as n¹⁸, which in turn,geometrically transforming into thin, large surface area to volume ratiosubstructure, designated herein as o¹⁸.

FIG. 19 shows a top view of the construction which FIG. 18 is across-section of, where m¹⁹ is a medium which can be transparent and/ortranslucent and/or opaque, of plastic and/or metal and/or other highthermally conductive material, which geometrically transforms and/ornarrows into stalk-like substructures rising past the solid-state lightsource, upward in reference to the FIG. 18, said stalk-likesubstructures, designated herein as n¹⁹, which in turn, geometricallytransforming into thin, large surface area to volume ratio substructure,designated herein as o¹⁹.

FIG. 20 is FIG. 18 with the addition of a commonly encounteredincandescent electric light bulb shaped enclosure, p²⁰, structurallyattached to standard socket shaped fixture, k²⁰, said bulb shapedenclosure, p²⁰, preferably being of a transparent and/or translucent,with optionally opaque areas or regions, character. The bulb shapedenclosure, p²⁰, is preferably of a high thermo energy conductivematerial or materials. The bulb shaped enclosure's, p²⁰, surface, eitherthe exterior surface and/or the interior surface, is preferably of ahigh-surface-area to projected surface area geometry. The bulb shapedenclosure's, p²⁰, surface or surfaces may be of a hydrophilic and/orhydrophobic surface(s) geometry/nature. The interior, q²⁰, of the saidbulb shaped enclosure may be of a man-made quality vacuum, or filledwith a transparent and/or translucent, with optionally opaque regions,material(s), of a solid and/or liquid and/or gaseous phase for theoperational design temperatures, of a high thermo energy conductivenature or a combination of said material(s) and vacuum.

FIG. 21 is FIG. 20 with the addition of structure(s), r²¹, which servesas structural reinforcement if, q²¹, is a solid, and/or r²¹ has a lightreflector and/or light retro-reflective nature, and/or r²¹, is anincandescent electric element and/or fluorescent material, and/or r²¹contains solid-state light sources such as, but not limited to,electroluminescence. FIG. 21 includes alternate a²¹ configurations²¹showing two (2) or more light emitting diodes within an enclosure.

FIG. 22 is a top view of bulb shaped enclosure's, p²², surface,referencing FIG. 21.

FIG. 23 is another view of bulb shaped enclosure's, p²², surface.

FIG. 24 is top view of bulb shaped enclosure's, p²², surface, showingcross-section reference 9-9 which relates to FIG. 26.

FIG. 25 is a side view showing only the external surface.

FIG. 26 is FIG. 24's 9-9 cross-section from the top of the bulb surface,p²⁶, down to line indicate 10-10, below line indicate 10-10, the view isof the internal surface exposed when the socket, k²⁶, is cut away. Someelements not shown, for illumination purposes only, refer to FIG. 21.

FIG. 27 shows pulse of, cc²⁷, one or more solid-state light source(s),said pulse can be singly, or parallel if more than one solid-state lightsource, or within the pulse, serially in sequence to individualsolid-state light sources if more than one. When solid-state lightsource(s) are between energizing pulse, the dd²⁷, one or morethermoelectric element(s) is/are energized, said pulse can be singly, orparallel if more than one solid-state light source, or within the pulse,serially in sequence to individual solid-state light sources if morethan one.

FIG. 28 shows, as example, pulse to h²⁸ &/or i²⁸, one or more electricdevices(s), said pulse can be singly, or parallel if more than oneelectric device, or within the pulse, serially in sequence to individualelectric device if more than one. When electric device(s) are betweenenergizing pulse, one or more thermoelectric element(s), such as g²⁸is/are energized, said pulse can be singly, or parallel if more than oneelectric device, or within the pulse, serially in sequence to individualelectric devices if more than one.

FIG. 29 shows simplified graph of pulse relationship expressed in FIGS.27 & 28.

FIG. 30, the following provide background on alternate structure:

-   t³⁰ SILICON-   u³⁰ PHOSPHORUS LAYER,-   v³⁰ LED CHIP-   w³⁰ CATHODE-   x³⁰ ANODE-   y³⁰ CERAMIC SUBSTRATE-   z³⁰ ELECTRIC CONNECTION (LITZ)-   αα³⁰ ELECTRIC CONNECTION-   bb³⁰ THERMALLY CONDUCTIVE GLUE

FIG. 31, the following provide background on alternate structure:

-   ee³¹ SOLID STATE LIGHT SOURCE-   ƒƒ³¹ ELECTRICALLY CONDUCTIVE LAYER-   gg³¹ CERAMIC SUBSTRATE (COLD SIDE)-   hh³¹ THERMOELECTRIC DEVICE (PELTIER EFFECT)-   ii³¹ CERAMIC SUBSTRATE (HOT SIDE)-   jj³¹ HEAT SINK-   kk³¹ TORUS TRANSFORMER-   ll³¹ HEAT SINK-   mm³¹ CERAMIC SUBSTRATE (HOT SIDE)-   nn³¹ THERMOELECTRIC DEVICE (PELTIER EFFECT)-   oo³¹ CERAMIC SUBSTRATE (COLD SIDE)-   pp³¹ ELECTRICALLY CONDUCTIVE LAYER-   qq³¹ ELECTRIC COMPONENTS-   rr ³¹ THERMAL INSULATION-   ss³¹ THERMAL GRADIENT

FIG. 32 is in reference to FIGS. 23, 24, 25, & in particular FIG. 26.

FIG. 32 is a close-up from said FIGURES highlighting the presentinvention's mock-filament or stem and showing the present invention'sion-pump-fan(s) wherein tt³² denotes said ion-pump-fan's “barrel” anduu³² denotes said ion-pump-fan's “needle”. Not shown is the presentinvention's alternative embodiments of multiple, in series, in parallelor side-by-side ion-pump-fans, relative to the intended fluid-flowactuated by said ion-pump-fan(s).

FIG. 33 is in reference to FIG. 32. FIG. 33 discloses one (1) of thepresent invention's alternative locations for the present invention'ssensor(s) vv³³ of the solid-state device's or devices' performance(s)(in the case shown, LED(s)) to be modified by the present invention'sthermal-management (TM). Said sensor(s) role being the monitoring ofintended output of said solid-state device(s) and effectuating said TMto cause a change in said TM to achieve intended performance of saidsolid-state device(s). FIG. 33 also discloses one of the presentinvention's alternative locations for the present invention's antenna(s)denoted as . Said antenna(s), xx³³, providing one-way or two-waytransmission to and/or from a physical embodiment of the presentinvention for data which may be referenced to affect a change and/orreport on the TM and/or performance of the thermally-sensitivesolid-state device(s) which is/are the intended requirement of said TM.

FIG. 34 is in reference to FIG. 32. FIG. 34 discloses one of the presentinvention's alternative locations for the present invention's supportstructures, yy³⁴ providing alternative physical load(s) and/or thermalload(s) pathways. FIG. 34 also discloses one of the present invention'salternative locations, in the case shown providing a dual role for thesupport structure yy³⁴ for the present invention's intake port zz³⁴and/or outflow port zz³⁴ of fluid-flow associated with the presentinvention's intended thermal-management (TM).

FIG. 35 is in reference to FIGS. 23, 24, 25, & in particular FIG. 26.FIG. 35 discloses one of the present invention's alternative locations,in the case shown providing a dual role for the socket, k³⁵ to includethe present invention's intake port zz³⁵ and/or outflow port zz³⁵ offluid-flow associated with the present invention's intendedthermal-management (TM). Said fluid-flow, originating exterior to thepresent invention, is confined to passageway(s) provides thru and/oraround the intended solid-state device(s) to be effectuated by thepresent invention's TM, thru and/or around the present invention'sheat-sink elements, thermoelectric elements, ferrite-torus (tori)elements, ion-pump-fan(s) elements, singly or in any combination withthe intention of thermal-management, with the intended intake/outflowports being included in the present invention's bulb(s) and socket(s)structure. The volume between the inner and outer shells consisting ofthe socket, k³⁵, is devoted to fluid-flow passageway(s) as referencedabove except in an alternative embodiment of the present inventionwherein some of the volume defined by the inner and outer shell ofsocket, k³⁵, is consumed by a capacitor(s), ααα³⁵, structure socket toprovide high-voltage for the operation of the present invention'sion-pump-fan(s) and/or other support electronics associated with eitherthe TM or the solid-state device(s) to be influenced by the TM, or both.Such an intended use is better shown in FIG. 36 which is thecross-section denoted in FIG. 35 as 12-12. Said capacitor(s), ααα³⁵,providing both the intended electrical function and the physicalstructural role of maintaining the physical integrity of the fluid-flowpassageway(s) from collapse due to outside applied physical loads.

FIG. 36 is in reference to FIG. 35, which is cross-section 12-12 of FIG.35, wherein socket, k³⁶, has defined inner shell bbb³⁶, outer shellccc³⁶, with said capacitor(s), ααα³⁶ and fluid-flow passageway(s),ddd³⁶.

FIG. 37 offers three (3) examples of serial/parallel energizing of three(3) solid-state components of the present invention. For theabove-referenced examples, the three (3) discrete solid-state componentschosen are: one (1) of the one (1) or more thermoelectric element(s),eee³⁷, included in the thermal-management (TM) which constitutes thecentral aspect of the present invention, one (1) of the one (1) or moreion-pump-fan(s), ƒƒƒ³⁷, included in the TM which constitutes the centralaspect of the present invention, and one (1) of the one (1) or more ofsolid-state device(s), ggg³⁷, to be influenced by the TM and which, inalternative embodiments of the present invention, the above-referencedsensor(s) (as, for example, see FIG. 33 and specifically that noted asvv³³), for this example said influenced solid-sate device(s) isconsidered to be a light-emitting-device (LED), such as referenced, forexample, in FIG. 33. FIG. 37 examples of serial/parallel energizing arerepresented by graphs with watts of energy, hhh³⁷, on the vertical axiswith the horizontal axis representing blocks or specific-lengths of timelaps before the serial/parallel energizing is repeated. Not shown isenergizing sequence(s) of other elements, either in serial and/orparallel, of the TM, such as but not limited to the present inventionalterative embodiments' elements such as the ferrite-torus (tori),sensor(s), antenna(s). It being noted that each of such elements exhibitdifferent initial energizing characteristics which offers TMopportunities which the present invention exploits.

1. A solid-state electronic passive cooling device.
 2. A solid-stateelectronic active cooling device.
 3. A device, as in claim 1 and claim2, comprising of at least one (1) functional solid-state electronic unitwhose operation is thermally supported by at least one (1)thermoelectric element; at least (1) solid-state electronic elementmounted on the one (1) thermoelectric element, at least one (1) ferritetorus, with all referenced elements within an enclosure having anelectrical energy connection.
 4. A device as in claim 3, where saidenclosure is transmissive to specific light spectrum.
 5. A device, as inclaim 3, wherein quantity of said specific light spectrum determines theenergy directed to said one or more ion-pump-fan(s).
 6. A device, as inclaim 3, wherein quantity of said specific light spectrum determines theenergy directed to said one or more thermoelectric element(s).
 7. Adevice, as in claim 3, wherein quantity of said specific light spectrumdetermines the energy directed to said one or more said functionalelectronic unit(s).
 8. A device, as in claim 3, wherein said functionalelectronic unit is one or more light emitting diode(s).
 9. The device,as in claim 3, wherein said functional electronic unit is one or moremicroprocessor(s).
 10. A device, as in claim 3, comprising of at leastone (1) ion-pump-fan element; at least one (1) thermoelectric element;and at least (1) solid-state electronic element mounted on the at least(1) thermoelectric element.
 11. A device, as in claim 3, comprising ofat least one (1) ion-pump-fan element; at least one (1) thermoelectricelement; and at least (1) solid-state electronic light-emitting diodeelement mounted on the at least (1) thermoelectric element.
 12. Adevice, as in claim 3, wherein the device comprises of a housing; anion-pump-fan coupled to said housing; a thermoelectric element coupledto said housing, with at least one (1) solid-state light emittingelement mounted on said thermoelectric element.
 13. The device, as inclaim 3, wherein said ion-pump-fan element and said thermoelectricelement and said solid-state light-emitting element are supplied withelectric power through the same terminal.
 14. The device, as in claim 3,wherein the ion-pump-fan element is driven independently.
 15. Thedevice, as in claim 3, wherein the thermoelectric element is drivenindependently.
 16. The device, as in claim 3, wherein the solid-statelight emitting element is driven independently.
 17. The device, as inclaim 3, wherein the ion-pump-fan moves fluid-mass thru thethermoelectric element's gaps between said thermoelectric element's Nand P sub-elements.
 18. The device, as in claim 3, wherein said housingincludes an aerodynamic element influencing said ion-pump-fan'sfluid-intake's fluid-flow.
 19. The device, as in claim 3, wherein saidhousing includes an aerodynamic element influencing said ion-pump-fan'sfluid-flow portals.
 20. The device, as in claim 3, wherein saidthermoelectric element incorporates passageways thru both the intendedhot-side and intended cold-side allowing for the passage of fluid flowencouraged by the ion-pump-fan of fluid-mass from one side of thethermoelectric element to the other side of the thermoelectric element.